ACTIVE

Tohoku University Engineering Short Program (TESP) Winter 2026

Tohoku University (School of Engineering)
🇯🇵 Japan
Duration:03 Dec 2026 - 18 Dec 2026
Nomination Deadline:27 Oct 2026
Application Deadline:29 Oct 2026

1. Program Overview

  • Program Name: Tohoku University Engineering Short Program (TESP) Winter 2026
  • Program Dates: December 3–18, 2026
  • Host Institution: Tohoku University, Japan (School of Engineering, with the International Research Institute of Disaster Science and the Semiconductor Creativity Hub)
  • Language: English
  • Academic Credit: Equivalent to 4 ECTS credits (includes coursework, laboratory activities, and an oral presentation). A certificate of completion is awarded to successful participants.
  • Theme: Resilient Essential Systems

2. About the Program

TESP Winter 2026 is an intensive international program that blends hands-on research in Tohoku University laboratories with entrepreneurship-oriented, project-based learning. Participants work in multicultural teams to tackle real-world social challenges, design value propositions, and connect specialized engineering and deep-tech research to tangible societal solutions. The program also features field trips, Japanese language classes, and cultural experiences (such as kimono dressing, tea ceremony, and doll painting) alongside interactions with local students.


3. Financial Support & Fees

  • Program Fee: 110,000 JPY
  • Inclusions: Tuition, experimental materials, cultural and social activities, field trips, and cafeteria vouchers.
  • Exclusions: Accommodation, local transportation, airfare, and insurance (must be covered by the participant).
  • Payment Deadline: Accepted students must pay via debit or credit card by November 5, 2026.
  • Scholarships: Tohoku University does not offer any other financial aid or scholarships for this program.

4. Eligibility Criteria

  • Must be a current student officially nominated by their home university.
  • Primarily open to engineering students, though non-engineering students are eligible to apply for the Disaster Risk Education Course.

5. Program Structure

The program revolves around the core theme of “Resilient Essential Systems,” exploring how science and engineering can secure everyday systems against disruptions.


  • Entrepreneurship Module: Project-based learning focusing on problem identification, opportunity assessment, market exploration, problem reframing, value design, feasibility assessment, and a final pitch.
  • Laboratory Activity Module: Placement in Tohoku University labs based on academic background, applying research to real-world challenges alongside faculty and researchers.
  • Additional Modules: Japanese cultural experiences, language classes, and field trips.

6. Available Courses & Accommodation

  • Extended Deadline Courses:

    • Chemical Engineering Course
    • Disaster Risk Education – Disaster Science Course
    • Tsunami Engineering – Disaster Science Course
  • Accommodation: Participants are responsible for booking their own lodging. Check-in must be completed no later than December 2, 2026. Tohoku University support can assist with finding affordable options.

7. Application Process and Deadlines

  • Application Deadline: October 29, 2026 (JST)
  • Nomination Requirement: Interested students share the interest at outbound@ge.iitm.ac.in.
  • Selection Process: Applications are screened, and offers are made on a first-come, first-served basis. Results are sent via email within 3 working days of submission. Acceptance is subject to university security export control screening.
  • Payment Deadline: November 5, 2026

8. Required Documents

All documents must be uploaded in English via the online application form:


  • Academic transcript of the current degree program.
  • Personal statement (maximum 1 page).
  • CV including a portrait photo. Crucial: Must include all education and employment history from high school enrollment to the present, with month-level detail and no chronological gaps (required for Security Export Control).
  • Photocopy of passport (photo and personal information pages).

9. Additional Resources